Solutions

High-quality reporting, experienced Engineers, and efficient processes

Criteria Labs has extensive device qualification capabilities with a broad range of in-house solutions to address any requirement. Our experienced Reliability Engineers can create qualification plans and perform testing for semiconductor die and packages.

To stress these components and assemblies, Criteria Labs has developed a unique set of stress ovens, temperature cycles, and humidity chambers that can properly apply the required stress conditions. With over twenty years’ experience designing burn-in boards, test boards, and carriers, we can provide the necessary support to design high-temperature aging and test solutions.

Criteria Labs has developed unique carriers, test boards, and other techniques for extended life testing of electrical components at high temperatures. During life test, parts are typically pulled at selected intervals. Electrical test and device qualification data are collected for parameter drift analysis and curve fitting performed for erroneous equation wear out calculations and life predictions.

 

Qualification Capabilities

Pre-Conditioning MSL Sensitivity Testing Temperature Cycle Thermal shock/Liquid to Liquid THB HAST HTS HTOL/LTOL/LTSL Autoclave Salt Atmosphere Lead Integrity Hermeticity – Fine/Gross Leak CSAM Centrifuge/Constant Acceleration Wire Bond Shear Test Wire Bond Pull Test Die Shear Test Ball Grid Array (BGA) Ball Shear

Mark Permanency Solderability Physical Dimension RTS Mechanical Shock Mechanical Vibration Moisture resistance MSL Characterization Reflow Characterization Bake & Dry Pack Burn in Board Design Electrical Testing at temp -65c thru 250c Lead torque Pin D Bond Shear Group Testing Endurance Test Device Characterization IPC 9701 and GR-468 second level package stress testing

Typical Space Qualification Flow